Temperature Dependent Band Gap Correction Model Using Tight-Binding Approach for UTB Device Simulations
نویسندگان
چکیده
In order to accurately determine the electrostatics of Ultra-Thin-Body (UTB) devices, semi-empirical tight-binding (TB) approach is widely used for calculating channel thickness dependent band structure any material at those temperatures where TB parameters are available (generally defined 0 K and 300 K). this work, we analyze variation Si, Ge, GaAs over different thicknesses K, show that curvature minima remains unchanged with temperature, while gap changes significantly affects electrostatics. Based on finding, propose an simulate UTB temperature between using obtained along a suitable temperature-dependent correction. From results charge density, good agreement based simulation results, wide range thicknesses, GaAs, also showing TCAD typical intermediate 150 thus highlighting accuracy, simplicity applicability proposed approach.
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ژورنال
عنوان ژورنال: IEEE Transactions on Nanotechnology
سال: 2023
ISSN: ['1536-125X', '1941-0085']
DOI: https://doi.org/10.1109/tnano.2022.3232778